Application of laser processing technology in mobile phone camera module

Not long ago, ofI light, a brother of mobile phone lens module, launched what is said to be the world's first periscope continuous zoom lens module with a thickness of only 5.9mm, and Xiaomi was not outdone. At the press conference, it showed the concept product telescopic zoom lens, which is said to have increased the light input by 300%.

 

Behind the rapid update and iteration of mobile phone camera module is the rise of a huge Chinese force.

 

Relevant surveys show that optical enterprises such as SunYu optics, ofI optics, Ruisheng technology and Qiuti technology have become leading players in the field of smart phones.

 

The popularization and promotion of 5g infrastructure and the rise of giants will usher in a new outbreak of smartphone camera module.

 

It is understood that the core components of smart phone camera module are CMOS imaging sensor (CIS) and lens, which respectively account for about 50% and 20% of the cost of the whole lens module, while the module technology accounts for 20% of the cost.

 

For the manufacturing of smart phone camera module, what kind of processing method can save cost and meet the current high-precision market demand? This is a problem that manufacturers are very concerned about.

 

As a non-contact processing tool, laser can focus high-intensity light energy on a small focus, and can carry out laser cutting, drilling, marking, welding, scribing and other processing on materials. It is very suitable for the processing and manufacturing of mobile phone camera module, which can improve the processing efficiency, save costs and better meet the current demand of precision. Therefore, the outbreak of smart phone camera module industry has brought more development opportunities for the laser industry!

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Application of laser processing technology in mobile phone camera module

In the manufacturing of mobile phone camera module, the laser processing technology mainly used in camera module includes PCB laser cutting and marking, chip marking, bracket laser welding, glass laser cutting, motor laser welding and marking, lens laser marking, etc.

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Laser cutting and marking of PCB

Generally speaking, the PCB of mobile phone camera module is composed of FR4 and FPC, which can be cut and marked by laser. The following is the effect picture of laser cutting and laser marking of camera module:

Among them, FPC flexible printed circuit board (FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC FPC. Due to the increasing density and pitch of FPC flexible circuit board, and the more complex FPC graphics, it is more and more difficult to make FPC mold. The laser cutting FPC adopts the numerical control processing situation, without mold processing, which can save the mold opening cost. By focusing the high beam quality laser beam into a very small spot, a high power density is formed at the focus, so that the material to be cut vaporizes or melts in an instant, and then the molten material is removed from the light action zone by external force, thus forming a cutting seam.

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Chip laser marking

 

Laser marking on mobile phone camera chip is also an important application. Generally speaking, the laser marking of mobile phone camera module chip is mainly used to mark the logo of the enterprise, product information, application import of internal traceability system and laser marking of two-dimensional code on the chip surface.

 

Laser welding technology of bracket

 

In the mobile camera module, the conductive metal module on the bracket is small and very thin, and the welding requirements are high. Laser welding technology can effectively strengthen the welding firmness, improve the electrical conductivity and will not damage it.

 

Because the glass in camera module belongs to ultra thin glass, it is not only necessary to avoid breaking, but also ensure its strength and edge breakage rate in the process of processing. Therefore, laser cutting is also an important application in the manufacture of camera module glass. In addition, laser marking in lens and motor is mainly used in two-dimensional code with the surface or edge mark less than 0.5 * 0.5mm, which plays a role of anti-counterfeiting and tracing.

 

The explosion of mobile camera module industry has created a huge development space for small and medium-sized enterprises. In order to ensure the camera photo effect, each camera product should keep a high consistency. In addition, special cutting fixture is needed for cutting bracket, and high-definition CCD may be used for positioning. To create such a precise product, high precision laser cutting technology is undoubtedly the demand of the current market!

 

In FPC laser cutting, the UV FPC laser cutting machine introduced by Yuanlu photoelectric has a special small thermal impact area of 10 μ m. It is suitable for the shape laser cutting, plate splitting and drilling of FPC soft plate and soft hard joint plate. The cutting edge is neat, smooth, without burr and glue overflow. The cutting samples are as follows.

 

Before, brocade fiber laser also launched a mobile camera module laser cutting machine, which is said to be able to directly cut complex shape on the substrate according to different design data, automatically feeding and unloading, reducing manual operation, faster speed and higher consistency, and also ensuring no burr and residue on the processing edge, good long-term stability and high precision.

 

In addition, BOT has launched a Laser marking machine for UV mobile camera. The marking machine can mark each camera module with clear and readable two-dimensional code, and pass it to the next process. Through intelligent camera identification and associated with internal system, it can effectively query the manufacturer and control the problems in the production process.