What's the difference between UV Laser marking machine and other Laser marking machines with different light sources?
The principle of marking is almost the same, which is to use laser beams to make permanent marks on different material surfaces. The effect of marking is to expose the deep material through the evaporation of the surface material, or to "carve" the trace through the chemical and physical changes of the surface material caused by the light energy, or to burn off part of the material through the light energy, showing the required etched pattern, text, and the content of the product to be marked. The light source of the laser generator is different
Ultraviolet Laser marking machine uses 355nm ultraviolet laser, which belongs to ultraviolet light source, also known as blue laser beam. Generally, frequency doubling technology is used to convert the infrared light (1064nm) emitted by solid-state laser into 355nm (third harmonic generation) and 266nm (fourth harmonic generation) ultraviolet light. Its photon energy is very large, and it can match with the energy levels of some chemical bonds (ionic bond, covalent bond, metal bond) of all substances in nature. It directly breaks the chemical bond and causes photochemical reaction of materials without obvious thermal effect, so it is called cold working. Not only the beam quality is good (fundamental mode output), but also the focusing spot is smaller (diameter is less than 3um, divergence angle is 1 / 4 of the fiber pumped laser), which can greatly reduce the mechanical deformation of the material, and the processing heat effect is very small, and there is no thermal effect and material burning problem. The fiber Laser marking machine uses 1064nm fiber laser, It refers to a kind of laser generated by using glass fiber doped with rare earth elements (such as ytterbium) as gain medium, which has very rich luminous energy levels. The wavelength of pulsed fiber laser is 1064nm (the same as YAG, but the difference is that the working material of YAG is neodymium) (the typical wavelength of QCW and CW fiber laser is 1060-1080nm, although QCW is also a pulsed laser, But its pulse generation mechanism is completely different, wavelength is not the same), is a kind of near-infrared laser, electro-optic conversion efficiency is high, the use of air-cooled cooling, output beam quality is good, high reliability, belongs to hot processing. CO2 Laser marking machine adopts infrared band 10.64 μ The CO2 gas is charged into the high-voltage discharge tube to produce glow discharge, which makes the gas molecules release the laser. After the laser energy is amplified, the laser beam for material processing is formed. The laser beam gasifies the surface of the processed body to achieve the purpose of carving.
Different processing methods
Generally, for fiber Laser marking machines and CO2 Laser marking machines, the thermal effect of laser on materials is used to achieve, or through heating and gasification of surface materials, the materials with different colors in deep layer are exposed, or the microscopic physical and physical changes (such as some nano and ten nanometer micropores will produce blackbody effect, Light can rarely be reflected, making the material appear dark black) and make its reflective performance change obviously, or some chemical reactions occur when the light energy is heated, and the required information such as graphics, characters, two-dimensional codes and so on is displayed. The UV Laser marking machine can directly break a chemical bond of the material, which is the molecular separation from the object and is processed by chemical method, The main difference between the two different processing methods is that the laser physical processing method is mainly in the surface of the product and material, and the laser chemical processing method can be processed by laser penetrating into the inside of the product material.
Application areas are different
Fiber Laser marking machine is the most common Laser marking machine, which can meet the permanent marking of most metal or non-metallic substrate. It can be used to mark the depth on hard materials, such as bearing marking, engine number marking, metal nameplate marking, etc. UV laser marking function can achieve super fine marking and carving, which is the best product for customers with higher marking effect. The main plastic materials, such as flexible PCB, LCD, TFT, are suitable for marking glass, polymer materials and other objects. The silicon wafer micro holes and blind holes are processed. The UV wavelength is only 355, and the depth of hard materials can not be marked in. Although UV laser can mark both metal and nonmetal, due to cost factors, optical fiber laser is generally used to mark metal materials, while UV laser is used to mark products with high surface quality requirements and difficult to achieve by CO2 Laser marking machine, and the formation of CO2 is matched. Among them, 80% of the data lines on the market, and the adapter marking is all from UV laser marking.